Application

Wafer Polishing Equipment

In the wafer polishing process of semiconductor manufacturing equipment, it is necessary to maintain the flatness of the upper plate, which contains the attached wafer, and the rotary table (lower plate) on which the polishing cloth is laid. If there are any defects, the wafers will be unevenly walled, and flatness will not be achieved, making uniform polishing impossible. In addition, the wafer will be out of focus during the exposure process.

The flatness of the wafer is most important for the subsequent exposure process, so the wafer must be made to maintain flatness during the polishing process.

Our digital level is used to ensure the flatness of the upper and lower surface plates.